Wafer Level Packaging
MacDermid Enthone wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.
Semi Conductor Packaging
MacDermid Enthone ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.
Printed Circuit Board
Smartphones, 3D/4K Technology. Virtual Reality. Military devices. No matter where you look, electronics and the printed circuit boards that enable them are getting smaller and more complex.